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AVI to WAV Converter: Extract WAV Audio from AVI
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ISS: 45nm norms will be a critical frontier for the semiconductor industry
The Industry Strategy Symposium (ISS) was held last week and focused on 45nm process technology. However, the most painful issue, as it turned out, is not the technical problems facing the developers, but the financial ones – only a few companies can afford to switch to new technical processes.
First 45nm ICs expected to be released by 2021. Most likely, 193nm immersion lithographic tools will be used for this. This is where the main stumbling block lies – each such tool costs from 20 to 30 million dollars, which is comparable, for example, to the cost of a Boeing 737 (23 million. dollars according to a representative of VLSI Research who spoke at ISS, or 44-74 million. dollars according to Boeing). In total, according to Semico Research, the cost of a 300-mm plant for processing wafers according to 45-nm standards will be from 3 to 3.5 billion. dollars.
The most difficult question that semiconductor chip manufacturers will have to solve is the cost of new production lines, of course, is a consequence of the incredible amount of effort invested in the development of new technologies. However, there are also purely technical problems, and if they are not solved, technological progress may even stop at the 45 nm line. For example, an AMD spokesman noted that there are very few materials that can be used for 45nm transistors; high-k gate stacks, metal gates, low-k dielectrics.
Thus, after 45nm standards, according to Samsung employees, “it will be necessary to make new revolutionary discoveries” to continue progress and reduce the size of the elements. Let us note from ourselves: there is still hope that progress at 45-nm norms will not stop – if traditional (laser) lithography is not destined to live longer, then the banner from weakening hands will be able to intercept electronically for some time -beam lithography, and there, you see, the EUV will be brought to mind.