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Ga-ep43-ds3l.GA-EP43-DS3L (rev. 1.0)




Find a product.GA-EPDS3L (rev. ) Support | Motherboard – GIGABYTE Global


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Ga-ep43-ds3l.GA-EPDS3L (Rev. ) | Motherboard – GIGABYTE

Supports Intel® Core™ 2 multi-core and 45nm processors Support for (O.C.) MHz FSB Dual channel DDR2 + for remarkable system performance Ultimate graphics performance with PCI-E x16 interface Integrated SATA 3Gb/s 8-Channel High Definition Audio Features high speed Gigabit Ethernet Revolution energy saving design with DES Advanced featuring hardware based Dynamic 4 . original motherboard for Gigabyte GA-EPDS3L LGA DDR2 USB 16GB EPDS3L P43 desktop motherboard Free shipping Get Ultra Low-Price$$: – 9 – Only for GA-EPDS3L. Only for GA-EPS3L. Only for GA-EPDS3LR. 1 PCI Express x16 LGA Processor Host Interface Intel® P43 Dual BIOS 2 PCI PCI Bus.
Gigabyte GA-EP43-DS3L – motherboard – ATX – LGA775 Socket – P43 Specs
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Gigabyte GA-EPDS3L – motherboard – ATX – LGA Socket – P43 Specs – CNET

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GA-EPDS3L (rev. ) Overview | Motherboard – GIGABYTE Global
ProMOS Reduces Contract Manufacturing Capacity: Reverse Process Begins

ProMOS Technologies removes the redundancy of a part of the capacity at the 8-inch
the factory set aside for contract manufacturing will use them for
memory release for OEM PC builders. As a reminder, ProMOS also intended
increase the number of plates used for contract manufacturing from 15
thous. in the second quarter up to 25 thousand. in the 4th quarter – mainly on a contract basis
based on the plan to release Pseudo SRAM and SDRAM with reduced power consumption.
The share of capacities allocated for contract manufacturing should have been
30% of the total capacity of the company’s production lines.

According to the president of the company, the reason for the reverse reduction of “contract”capacity is a decrease in the demand of contract customers and an excess of demand
on products by OEM PC assemblers. According to the company’s specialists, at present
time demand for ProMOS memory exceeds supply by 10%. Accordingly, it is
by this amount, contract launches were reduced, moreover, in the next quarter,
which is a season of traditionally low demand, the company will continue to reduce
capacities allocated for the production of microcircuits under the contract.

It is worth recalling that at the moment ProMOS produces DRAM chips of high
density and a range of niche products including pseudo-SRAM, low power SDRAM
and MCM. The company owns one 8 “and one 12” factories using
for serial production of 0.14 and 0.12-micron components. Total
the productivity of factories is 86 thousand. conditional (8-mm.) plates monthly.

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