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Gigabyte ga-m61sme-s2.Gigabyte GA-M61SME-S2 – motherboard – micro ATX – Socket AM2 – GeForce 6100 Specs

 

Gigabyte ga-m61sme-s2

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Troubleshooting.GA-M61SME-S2 (rev. 2.x) Overview | Motherboard – GIGABYTE U.S.A.

 

Motherboard Gigabyte GA-M61SME-S2 User Manual. Amd athlon 64 fx / athlon 64 x2 dual-core / amd athlon 64 / sempron am2 processor motherboard (80 pages) Motherboard Gigabyte . Supports AMD Athlon/ Sempron Supports Dual Channel DDR2 memory Integrated NVIDIA® CineFX Graphics Engine Features NVIDIA® SATA 3Gb/s with RAID function Features 8-channel High-Definition Audio Enhances security with NVIDIA® TCP/IP Acceleration technology Integrated 10/ network connection Supports Microsoft® Windows Vista™ Premium RoHS compliant motherboard for . The new S series motherboards GA-M61SME-S2; supporting AMD new generation AM2 processor with dual channel DDR2 MHz high frequency memories, providing reliable and user friendly computing and reaching the maximum system performance easily via personalized software settings.

 

Gigabyte ga-m61sme-s2.GA-M61SME-S2 (Rev. 2.x) | Motherboard – GIGABYTE

Supports AMD Athlon/ Sempron Supports Dual Channel DDR2 memory Integrated NVIDIA® CineFX Graphics Engine Features NVIDIA® SATA 3Gb/s with RAID function Features 8-channel High-Definition Audio Enhances security with NVIDIA® TCP/IP Acceleration technology Integrated 10/ network connection Supports Microsoft® Windows Vista™ Premium RoHS compliant motherboard for . GIGABYTE provides new innovated 3D sensing product -Time of Flight (ToF) camera. ToF camera is a special purpose, low-cost smart solution with novel 3D imaging capture technology. The ToF camera includes high-performance advanced analytics as a standard feature, improving measurement accuracy and performance when compared to the current. GA-M61SME-S2 Motherboard – 10 – Feature Summary CPU Socket AM2 for AMD AthlonTM 64 FX / AthlonTM 64 X2 Dual-Core / AthlonTM 64 / SempronTM processor Front Side Bus MHz Chipset nVIDIA® GeForce /nForce chipset LAN Realtek phy (10/ Mbit) Audio Onboard Realtek ALC CODEC chip Supports High Definition Audio.
 
 
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GA-M61SME-S2 (rev. 2.x)

GA-M61SME-S2 (rev. 2.x) Descripción | Tarjetas Madre – GIGABYTE Argentina
Stretched Silicon Improvements – Dual Stress Liners

Co-developed by IBM and
AMD, which is called Dual Stress Liners (DSL,
not to be confused with Digital Subscriber Line) should provide
an increase in the performance of modern chips that will be produced with
the use of improved “stretched silicon” technology.

At the moment, there are already sales of processors using
strained silcon technology,
– for example, Intel Prescott, manufactured according to the process technology
90 nm. However, both companies are using advanced technology (DSL)
for new models, produced in both 90nm and 65nm standards.

According to preliminary data, improvements include
increasing the performance of transistors by 24% -30%. However, the implementation itself
DSL into production does not reduce the number of usable chips by
silicon wafer, which means that the production cost will not increase, t.e.
adaptation of the new technology seems to be acceptable – without additional costs, and
this means that it will have a favorable effect on the final price of the microprocessor.

Stretched silicon implies the arrangement of atoms in a layer
silicon in such a way that electrons are able to move faster from one
end of the transistor to the other. T.e. the process of opening-closing the transistor occurs
faster up to 30%, which increases the speed of the chip. At the moment, many
companies use germanium in their production under a layer of transistors, which
ensures the location of transistors at some distance from each other.
The use of germanium negatively affects the price for AMD too
already
there have been attempts to produce chips in this way. However, production had to
collapse due to the complexity of the technical process. The use of germanium allows only
partially optimize the production process, affecting only
N transistors.

AMD Representative Nick Kepler
(Nick Kepler) has not yet clarified the materials used in DSL technology,
but it is precisely the use of different materials in production that allows
double optimization of the operation of transistors – improving also the hole conductivity in
transistors (P-channel).

Both IBM and AMD promise to provide official
data and details regarding Dual Stress Liners on December 13-15
in San Francisco IEEE Exhibition and Conference
International Electron Devices Meeting 2021.

Chip production using DSL
will also fuel interest in all chip companies. Processors from
Intel’s 65nm technology also uses
improved “stretched silicon” technology. The release of these processors is expected
by the end of the year.

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